The development status of lead frame

Emerging products and applications such as artificial intelligence, 5G, Internet of Things, intelligent manufacturing, and new energy vehicles have continuously promoted the continuous development of the semiconductor packaging materials market. The intelligent, functional diversification, light and thin miniaturization of terminal equipment have prompted packaging materials including lead frames to evolve towards high density, high reliability, high heat dissipation, low power consumption and low cost.

Like other semiconductor sub-sectors, the lead frame industry is a technology-intensive and capital-intensive industry. Among China 's lead frame enterprises, the lead frames produced by foreign-funded enterprises in China and domestic enterprises account for about 50 % respectively, mainly concentrated in the Yangtze River Delta and the Pearl River Delta. 

Due to the late start of domestic enterprises in the field of etching lead frame, the foundation is relatively weak, and the production equipment, products and technology are relatively backward. In terms of product structure, foreign-funded enterprises occupy a relatively high-end market in the domestic lead frame. In terms of technology, the products of domestic lead frame manufacturers are mainly stamping lead frames, and the proportion of etching lead frames is still very small. Nowadays, many domestic enterprises have increased their R & D investment in lead frame, and domestic substitution is in full swing. 

Lead frame related production enterprises are : Jusheng Metal Technology, New Optoelectronics, Relief Printing, ASM, Mitsui High-tech, Shunde Industry, Jielin Technology, Changhua Technology, Bairong Electronics, Fusheng Precision, Ningbo Kangqiang Electronics, Tongling Fengshan Sanjia, Yonghong Electronics, Ningbo Hualong Electronics, Guangzhou Fengjiang, Huatian Technology and so on.